The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 15, 2021

Filed:

Oct. 23, 2019
Applicants:

Zilltek Technology (Shanghai) Corp., Shanghai, CN;

Zilltek Technology Corp., Hsinchu, TW;

Inventor:

Jinghua Ye, Shanghai, CN;

Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
A61F 11/06 (2006.01); H04R 19/02 (2006.01); G10K 11/178 (2006.01); G10L 19/00 (2013.01); H04R 1/10 (2006.01); H04R 3/00 (2006.01); H04R 1/40 (2006.01);
U.S. Cl.
CPC ...
H04R 19/02 (2013.01); G10K 11/17854 (2018.01); G10K 11/17873 (2018.01); G10L 19/00 (2013.01); H04R 1/10 (2013.01); H04R 1/406 (2013.01); H04R 3/005 (2013.01); G10K 2210/1081 (2013.01); G10K 2210/3028 (2013.01); H04R 2201/003 (2013.01); H04R 2420/07 (2013.01); H04R 2460/01 (2013.01); H04R 2460/13 (2013.01);
Abstract

The invention relates to the field of electronic technology, and more particularly, to a microphone structure. A MEMS (Micro-Electro-Mechanical System)-based bone conduction sensor comprises: a closed cavity within which a uniaxial or biaxial accelerometer sensor is arranged to be adjacent to bones of a human ear; an ASIC (application-specific integrated circuit) processing chip coupled to the uniaxial or biaxial accelerometer sensor, the ASIC processing chip being provided with an output end for a vibration signal. By adopting the above-mentioned technical solution, a bone conduction sensor with a closed cavity is provided in the present invention. Furthermore, a uniaxial or biaxial accelerometer sensor and an ASIC processing chip are arranged inside the closed cavity. In this way, the production costs are reduced, and interference of the sensor caused by ambient environment is reduced.


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