The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 26, 2023

Filed:

Feb. 04, 2022
Applicants:

Zilltek Technology (Shanghai) Corp., Shanghai, CN;

Zilltek Technology Corp., Hsinchu, TW;

Inventor:

Jinghua Ye, Shanghai, CN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04R 1/40 (2006.01); H04R 3/00 (2006.01); G10L 21/0216 (2013.01);
U.S. Cl.
CPC ...
H04R 1/406 (2013.01); H04R 3/005 (2013.01); G10L 2021/02166 (2013.01); H04R 2201/401 (2013.01);
Abstract

A microphone array system, comprises N microphones, including a first microphone . . . a Nth microphone, wherein N is a natural number greater than 2. Each of the N microphones is provided with: an acoustic transducer for picking up a sound signal and converting the sound signal into an electric signal; a voice activation detector, connected to a corresponding acoustic transducer, and configured to perform a voice activation detection on the electric signal and form an activation signal; a buffer memory, connected to the acoustic transducer, and configured to store a 1/N electric signal of a predetermined segment; a sound wire interface, connected to a corresponding acoustic transducer, the buffer memory, and the voice activation detector, wherein the sound wire interface is connected to an external master chip via a sound wire bus for outputting the activation signal to the external master chip.


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