The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 07, 2021

Filed:

Jul. 29, 2020
Applicants:

Zilltek Technology (Shanghai) Corp., Shanghai, CN;

Zilltek Technology Corp., Hsinchu, TW;

Inventor:

Jinghua Ye, Shanghai, CN;

Assignee:

Other;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04R 1/00 (2006.01); H04R 1/04 (2006.01); B81B 7/00 (2006.01); H04R 1/06 (2006.01); H04R 3/00 (2006.01); H04R 19/04 (2006.01);
U.S. Cl.
CPC ...
H04R 1/04 (2013.01); B81B 7/0074 (2013.01); H04R 1/06 (2013.01); H04R 3/00 (2013.01); H04R 19/04 (2013.01); B81B 2201/0257 (2013.01); B81B 2207/012 (2013.01); B81B 2207/07 (2013.01); H04R 2201/003 (2013.01);
Abstract

A MEMS microphone with a hybrid packaging structure is provided. The microphone comprises: a first circuit board; a second circuit board, spaced apart from the first circuit board and parallel to the first circuit board; a packaging cover, covering the second circuit board, and forming an acoustic cavity with the second circuit board; wherein the first circuit board and the second circuit board form an accommodating space in which a pressure sensor is disposed. In the present invention, the chip and electronics of the MEMS microphone are installed on two different circuit boards, respectively, so that an interior space of the microphone is fully utilized, a good heat dissipation is achieved, a better sound transmission effect is achieved, and the microphone can be widely used.


Find Patent Forward Citations

Ye, Jinghua. (2021). Mems microphone with hybrid packaging structure (U.S. Patent No. 11197079). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11197079

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…