logo

For the Inventor, By the Inventor

Seoul, South Korea

Jin-ho Chun

USPTO Granted Patents = 13 

Average Co-Inventor Count = 5.7

ph-index = 3

Forward Citations = 265(Granted Patents)


Company Filing History:

goldMedal13 out of 131,611 
 
Samsung Electronics Co., Ltd.
 patents

Years Active: 2013-2023

Loading Chart...
13 patents (USPTO):Explore Patents
1. 11798906 - Semiconductor chip (2023-10-24),
2. 11469202 - Semiconductor device (2022-10-11),
3. 11251144 - Semiconductor chip (2022-02-15),
4. 10833032 - Semiconductor device (2020-11-10),
5. 10580726 - Semiconductor devices and semiconductor packages including the same, and methods of manufacturing the semiconductor devices (2020-03-03),
6. 10483224 - Semiconductor chip (2019-11-19),
7. 9698051 - Semiconductor chips having through silicon vias and related fabrication methods and semiconductor packages (2017-07-04),
8. 9691685 - Semiconductor devices and methods of manufacturing the same, and semiconductor packages including the semiconductor devices (2017-06-27),
9. 9520361 - Semiconductor devices (2016-12-13),
10. 9461007 - Wafer-to-wafer bonding structure (2016-10-04),
11. 8957526 - Semiconductor chips having through silicon vias and related fabrication methods and semiconductor packages (2015-02-17),
12. 8735281 - Inter connection structure including copper pad and pad barrier layer, semiconductor device and electronic apparatus including the same (2014-05-27),
13. 8456012 - Inter connection structure including copper pad and pad barrier layer, semiconductor device and electronic apparatus including the same (2013-06-04),

Title: Innovator Profile: Jin-ho Chun and His Contributions to Semiconductor Technology

Introduction: Jin-ho Chun is an accomplished inventor based in Seoul, South Korea, whose work has significantly impacted the field of semiconductor technology. With a total of 13 patents to his name, Chun has made substantial advancements that continue to influence the electronics industry.

Latest Patents: Among his recent innovations, Chun has developed two notable patents focusing on semiconductor designs. The first patent describes a semiconductor chip that features a semiconductor substrate with distinct bump and non-bump regions. This design includes a bump on the bump region and a passivation layer, which is thicker in the bump region compared to the non-bump region. Additionally, the passivation layer incorporates a step between these two regions, enhancing the chip's structural integrity.

The second patent highlights a semiconductor device that comprises a protective layer, a redistribution pattern, a pad pattern, and an insulating polymer layer. This innovative structure ensures a flat upper surface for the redistribution and pad patterns while maintaining a lower surface for the insulating polymer layer, contributing to a more efficient semiconductor design.

Career Highlights: Chun is currently associated with Samsung Electronics Co., Ltd., where his expertise is instrumental in advancing their semiconductor product line. His dedication to innovation and excellence has led to multiple advancements within the company's R&D initiatives, positioning Samsung as a leader in the semiconductor market.

Collaborations: Throughout his career, Jin-ho Chun has collaborated with talented colleagues, including Seong-min Son and Ho-jin Lee. These partnerships have fostered a creative environment that has been crucial in developing innovative solutions and pushing the boundaries of semiconductor technology.

Conclusion: Jin-ho Chun's contributions to semiconductor technology and his impressive portfolio of patents are a testament to his ingenuity and commitment to innovation. As he continues to work at Samsung Electronics Co., Ltd., Chun remains a vital figure in shaping the future of electronics and semiconductor devices.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…