The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 27, 2017

Filed:

May. 25, 2016
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Kyu-Ha Lee, Yongin-si, KR;

Hyung-Jun Jeon, Yongsan-gu, KR;

Jum-Yong Park, Yongin-si, KR;

Byung-Lyul Park, Seoul, KR;

Ji-Soon Park, Suwon-si, KR;

Jin-Ho An, Seoul, KR;

Jin-Ho Chun, Seoul, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/544 (2006.01); H01L 23/48 (2006.01); H01L 23/00 (2006.01); H01L 23/532 (2006.01); H01L 21/768 (2006.01); H01L 21/78 (2006.01);
U.S. Cl.
CPC ...
H01L 23/481 (2013.01); H01L 21/76852 (2013.01); H01L 21/76898 (2013.01); H01L 21/78 (2013.01); H01L 23/53223 (2013.01); H01L 23/53238 (2013.01); H01L 23/53266 (2013.01); H01L 23/544 (2013.01); H01L 24/02 (2013.01); H01L 24/13 (2013.01); H01L 2223/5446 (2013.01); H01L 2224/0239 (2013.01); H01L 2224/02372 (2013.01); H01L 2224/13024 (2013.01); H01L 2224/13139 (2013.01); H01L 2224/13147 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01047 (2013.01);
Abstract

A semiconductor device includes a substrate having a die region and a scribe region surrounding the die region, a plurality of via structures penetrating through the substrate in the die region, a portion of the via structure being exposed over a surface of the substrate, and a protection layer pattern structure provided on the surface of the substrate surrounding a sidewall of the exposed portion of the via structure and having a protruding portion covering at least a portion of the scribe region adjacent to the via structure.


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