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For the Inventor, By the Inventor

San Jose, CA, United States of America

Jick M Yu

USPTO Granted Patents = 22 

Average Co-Inventor Count = 3.4

ph-index = 7

Forward Citations = 672(Granted Patents)


Company Filing History:

goldMedal22 out of 13,684 
 
Applied Materials, Inc.
 patents

Years Active: 2005-2015

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22 patents (USPTO):Explore Patents
1. 9217197 - Methods for depositing a layer on a substrate using surface energy modulation (2015-12-22),
2. 8993434 - Methods for forming layers on a substrate (2015-03-31),
3. 8852674 - Method for segregating the alloying elements and reducing the residue resistivity of copper alloy layers (2014-10-07),
4. 8764961 - Cu surface plasma treatment to improve gapfill window (2014-07-01),
5. 8580354 - Plasma treatment of substrates prior to deposition (2013-11-12),
6. 8557094 - Sputtering chamber having auxiliary backside magnet to improve etch uniformity and magnetron producing sustained self sputtering of ruthenium and tantalum (2013-10-15),
7. 8349724 - Method for improving electromigration lifetime of copper interconnection by extended post anneal (2013-01-08),
8. 8324095 - Integration of ALD tantalum nitride for copper metallization (2012-12-04),
9. 8119525 - Process for selective growth of films during ECP plating (2012-02-21),
10. 8021514 - Remote plasma source for pre-treatment of substrates prior to deposition (2011-09-20),
11. 7737028 - Selective ruthenium deposition on copper materials (2010-06-15),
12. 7704887 - Remote plasma pre-clean with low hydrogen pressure (2010-04-27),
13. 7659204 - Oxidized barrier layer (2010-02-09),
14. 7494908 - Apparatus for integration of barrier layer and seed layer (2009-02-24),
15. 7352048 - Integration of barrier layer and seed layer (2008-04-01),

Title: Jick M Yu: Innovating Substrate Layering Techniques

Introduction: Jick M Yu is an accomplished inventor based in San Jose, CA, recognized for his significant contributions to the field of substrate layering methods. With a portfolio of 22 patents, Yu has made remarkable strides in developing advanced techniques that enhance the efficiency and quality of layer depositions in various applications.

Latest Patents: Among Yu's notable inventions are two recent patents focused on methods for depositing layers on substrates. The first patent outlines a method for conformally depositing a layer on a substrate featuring intricate structures. This method employs a first plasma to diminish the surface energy of the target material, enabling the deposited material to effectively wet the substrate’s surfaces and fill features through capillary action. The second patent further elaborates on this process by introducing a seed layer within the features and utilizing an etching technique that ensures precision in layer thickness, enhancing the overall structural integrity and performance of the features.

Career Highlights: Jick M Yu currently works at Applied Materials, Inc., a leading company in materials engineering. His innovative work at Applied Materials has positioned him as a key figure in the advancement of substrate technology, which is vital for the semiconductor and electronics industries.

Collaborations: Throughout his career, Yu has collaborated with esteemed coworkers, including Hua Chung and Praburam Gopalraja. This collaborative environment fosters innovation and the development of cutting-edge technologies that address the evolving needs of the market.

Conclusion: Jick M Yu exemplifies the spirit of innovation in the field of layer deposition methods. With his extensive patent portfolio and ongoing contributions at Applied Materials, he continues to play a crucial role in shaping the future of substrate technologies. Yu’s achievements not only highlight his expertise but also signify the potential for further advancements in the industry.

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