Hsinchu, Taiwan

Jiaw-Ren Shih

This inventor holds 61 USPTO granted patents, primarily in FinFET Technology (CPC class H01L). Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 1996-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Jiaw-Ren Shih. Retrieved from https://idiyas.com/inventor/jiaw-ren-shih

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 85.2

Average Co-Inventor Count = 3.2

ph-index = 12

Forward Citations = 564(Granted Patents)

Forward Citations (Not Self Cited) = 556(Dec 10, 2025)


Inventors with similar research interests:


Location History:

  • Hsiu-Chu, TW (1998)
  • Tou Liu, TW (1999 - 2001)
  • Tsing-chu, TW (2008)
  • Hsin-chu, TW (1996 - 2023)
  • Hsinchu, TW (2024)

Company Filing History:


Years Active: 1996-2026

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Areas of Expertise:
FinFET
Semiconductor Device
ESD Protection
Circuit Layout
Thermoelectric Devices
Bipolar SCR
Decoupling Capacitor
CMOS Structures
Oxide Trapping
High Voltage
Hot Carrier Lifetime
Nitrogen Implantation
61 patents (USPTO):Explore Patents

Title: Innovations by Jiaw-Ren Shih in Semiconductor Technology

Introduction

Jiaw-Ren Shih is a prolific inventor based in Hsin-Chu, Taiwan, with an impressive portfolio of 60 patents to his name. His contributions to the field of semiconductor technology have significantly advanced the development of modern electronic devices. Shih is particularly noted for his innovations involving Fin field effect transistors (FinFET), which have become essential in driving the efficiency and performance of next-generation integrated circuits.

Latest Patents

Among Shih's most recent patents are groundbreaking technologies related to FinFET devices. One notable patent describes a FinFET device that features position-dependent heat generation. This semiconductor device consists of a substrate with a uniform dielectric material layer, combined with two distinct pluralities of fins that vary in height. The design optimizes heat generation, potentially improving overall device performance.

Another significant patent discusses the integration of thermoelectric devices within FinFET technology. This innovation allows for enhanced thermal management in semiconductor devices, featuring a fin structure and connecting layers that facilitate heat transfer based on the direction of current flow. Such technological advancements are remarkable, demonstrating Shih's deep understanding of semiconductor behavior and thermal dynamics.

Career Highlights

Jiaw-Ren Shih has enjoyed a successful career at Taiwan Semiconductor Manufacturing Company Limited (TSMC), where he has focused on the research and development of advanced semiconductor technologies. His work has not only contributed to the company’s leadership in the industry but also positioned him as a key figure in the innovation landscape of semiconductor design.

Collaborations

Throughout his career, Shih has collaborated with esteemed colleagues such as Jian-Hsing Lee and Shui-Hung Chen. These collaborations have likely fostered an environment of innovation, allowing for the exchange of ideas and accelerating advancements in their collective research efforts.

Conclusion

In conclusion, Jiaw-Ren Shih's remarkable contributions to the field of semiconductor technologies highlight his role as a leading inventor. With a remarkable 60 patents under his belt, his recent innovations in FinFET technology demonstrate a commitment to enhancing the performance of electronic devices. Shih's work continues to inspire future advancements that push the boundaries of semiconductor engineering.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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