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For the Inventor, By the Inventor

Corvallis, OR, United States of America

Jian-Gang Weng

This inventor holds 12 USPTO granted patents and 1 EPO patent. Top assignee: Hewlett-Packard Development Company, L.p.. Active years: 2005-2012.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Jian-Gang Weng. Retrieved from https://idiyas.com/inventor/jian-gang-weng

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 12

% Patents Active = 33.3


Average Co-Inventor Count = 3.7

ph-index = 5

Forward Citations = 86(Granted Patents)


Company Filing History:

goldMedal12 out of 27,687 
 
Hewlett-Packard Development Company, L.p.
 patents

Years Active: 2005-2012

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12 patents (USPTO):Explore Patents
1. 8115313 - Method to form an interconnect (2012-02-14),
2. 8057656 - Crossover (2011-11-15),
3. 7757631 - Apparatus for forming a circuit (2010-07-20),
4. 7722190 - Projecting a luminance image (2010-05-25),
5. 7160745 - Metal-insulator-metal device (2007-01-09),
6. 7135405 - Method to form an interconnect (2006-11-14),
7. 7042057 - Process for creating metal-insulator-metal devices (2006-05-09),
8. 7014112 - Electronic identification label and interrogator for use therewith (2006-03-21),
9. 6979087 - Display system with interpretable pattern detection (2005-12-27),
10. 6967118 - Process for creating Metal-Insulator-Metal devices (2005-11-22),
11. 6927108 - Solution-processed thin film transistor formation method (2005-08-09),
12. 6867081 - Solution-processed thin film transistor formation method (2005-03-15),

Title: Innovator Spotlight: Jian-Gang Weng – Pioneering Patents in Corvallis, OR

Introduction:

Jian-Gang Weng, a prolific inventor based in Corvallis, Oregon, has made significant contributions to the field of technology with his innovative patent developments. With a total of 12 patents to his name, Weng's work has been instrumental in advancing interconnect and crossover technologies.

Latest Patents:

One of Weng's latest patents includes a groundbreaking "Method to Form an Interconnect," where electrodes are connected through conductive interconnects created from selectively sintered nanoparticles. Additionally, he has patented a unique "Crossover" method involving channel imprinting, conductor deposition, anodizing, and electroforming for enhanced electrical connections.

Career Highlights:

Currently employed at Hewlett-Packard Development Company, L.P., Weng continues to drive innovation and push the boundaries of technological advancements. His expertise and dedication have played a crucial role in shaping the company's research and development efforts.

Collaborations:

Weng collaborates closely with esteemed colleagues such as Ravi Prasad and Peter Mardilovich, combining their knowledge and skills to create cutting-edge solutions in the realm of interconnectivity and electrical engineering. Together, they form a dynamic team driving progress in the tech industry.

Conclusion:

Jian-Gang Weng's innovative spirit and pioneering work in the field of patents have solidified his position as a trailblazer in the realm of technology. His contributions continue to inspire advancements and shape the future of interconnect technologies, making him a notable figure in the world of innovation and invention.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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