The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 14, 2012
Filed:
Oct. 12, 2006
Applicants:
Jian-gang Weng, Corvallis, OR (US);
Ravi Prasad, Corvallis, OR (US);
Cary G. Addington, Albany, OR (US);
Peter S. Nyholm, Corvallis, OR (US);
Inventors:
Jian-Gang Weng, Corvallis, OR (US);
Ravi Prasad, Corvallis, OR (US);
Cary G. Addington, Albany, OR (US);
Peter S. Nyholm, Corvallis, OR (US);
Assignee:
Hewlett-Packard Development Company, L.P., Houston, TX (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01);
U.S. Cl.
CPC ...
Abstract
A plurality of electrodes are electrically coupled to each other by conductive interconnects formed from selectively sintered nanoparticles.
Weng, Jian-Gang. (2012). Method to form an interconnect (U.S. Patent No. 8115313). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8115313
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile