The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7042057 B1

PDF
Full Text
Expired
Date of Patent:
May. 09, 2006

Filed:

May. 05, 2005
Applicants:

Jian-gang Weng, Corvallis, OR (US);

Peter Mardilovich, Corvallis, OR (US);

John C. Rudin, Bristal, GB;

Adrian Geisow, Portihead, GB;

Inventors:

Jian-gang Weng, Corvallis, OR (US);

Peter Mardilovich, Corvallis, OR (US);

John C. Rudin, Bristal, GB;

Adrian Geisow, Portihead, GB;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/0232 (2006.01);
U.S. Cl.
CPC ...
Abstract

A process is described for fabricating an active addressing component such as a metal-insulator-metal (MIM) device by creating surface relief levels to form trenches, and depositing a metal in the trenches. The metal is anodized to create a non-linear dielectric. A second metal is deposited in the trenches to create an electrical with the dielectric which a contact is provided, and transferring the MIM device to a substrate by adhesive transfer.


Find Patent Forward Citations

Weng, Jian-gang. (2006). Process for creating metal-insulator-metal devices (U.S. Patent No. 7042057). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7042057

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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