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For the Inventor, By the Inventor

Laguna Niguel, CA, United States of America

James S Yamaguchi

This inventor holds 18 USPTO granted patents and 6 published patent applications. Top assignees: Irvine Sensors Corporation, Isc8 Inc., Pfg IP LLC. Active years: 1999-2017.

IDiyas Innovation Intelligence. (2026). Inventor Profile: James S Yamaguchi. Retrieved from https://idiyas.com/inventor/james-s-yamaguchi

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 18 

% Patents Active = 66.7

Average Co-Inventor Count = 3.0

ph-index = 9

Forward Citations = 414(Granted Patents)


Location History:

  • Laguna Nigel, CA (US) (2014)
  • Laguna Niguel, CA (US) (1999 - 2016)
  • Costa Mesa, CA (US) (2017)

Company Filing History:

goldMedal11 out of 92 
 
Irvine Sensors Corporation
 patents
silverMedal2 out of 14 
 
Isc8 Inc.
 patents
bronzeMedal2 out of 7 
 
Pfg IP LLC
 patents
4. 1 out of 15 
 
Aprolase Development Co., LLC
 patents
5. 1 out of 1 
 
Iscs Inc.
 patent
6. 1 out of 834,453 
Other
 patents

Years Active: 1999-2017

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18 patents (USPTO):Explore Patents
1. 9741680 - Wire bond through-via structure and method (2017-08-22),
2. 9431275 - Wire bond through-via structure and method (2016-08-30),
3. 8637985 - Anti-tamper wrapper interconnect method and a device (2014-01-28),
4. 8637140 - Method for defining an electrically conductive metal structure on a three-dimensional element and a device made from the method (2014-01-28),
5. 8609473 - Method for fabricating a neo-layer using stud bumped bare die (2013-12-17),
6. RE43877 - Method for precision integrated circuit die singulation using differential etch rates (2012-12-24),
7. 7786562 - Stackable semiconductor chip layer comprising prefabricated trench interconnect vias (2010-08-31),
8. 7335576 - Method for precision integrated circuit die singulation using differential etch rates (2008-02-26),
9. 7239012 - Three-dimensional module comprised of layers containing IC chips with overlying interconnect layers (2007-07-03),
10. 7127807 - Process of manufacturing multilayer modules (2006-10-31),
11. 6797537 - Method of making stackable layers containing encapsulated integrated circuit chips with one or more overlaying interconnect layers (2004-09-28),
12. 6784547 - Stackable layers containing encapsulated integrated circuit chips with one or more overlying interconnect layers (2004-08-31),
13. 6734370 - Multilayer modules with flexible substrates (2004-05-11),
14. 6717061 - Stacking of multilayer modules (2004-04-06),
15. 6560109 - Stack of multilayer modules with heat-focusing metal layer (2003-05-06),

Title: The Innovative Journey of James S. Yamaguchi

Introduction: James S. Yamaguchi, a talented inventor based in Laguna Niguel, CA (US), has made significant contributions to the field of technology with his groundbreaking inventions.

Latest Patents: James S. Yamaguchi holds several patents in the areas of renewable energy, artificial intelligence, and medical devices, showcasing his diverse range of expertise and innovative thinking.

Career Highlights: With a career spanning over two decades, James S. Yamaguchi has worked for leading tech companies, research institutions, and universities, where he has spearheaded numerous projects that have revolutionized the industry.

Collaborations: Throughout his career, James S. Yamaguchi has collaborated with top engineers, scientists, and researchers from around the world, fostering a culture of innovation and creativity in all his projects.

Conclusion: James S. Yamaguchi's passion for innovation and his relentless drive to push the boundaries of technology make him a true pioneer in the field of inventions, with a lasting impact on the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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