The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 31, 2006

Filed:

May. 07, 2003
Applicants:

James Satsuo Yamaguchi, Laguna Niguel, CA (US);

Angel Antonio Pepe, Irvine, CA (US);

Volkan H. Ozguz, Aliso Viejo, CA (US);

Andrew Nelson Camien, Costa Mesa, CA (US);

Inventors:

James Satsuo Yamaguchi, Laguna Niguel, CA (US);

Angel Antonio Pepe, Irvine, CA (US);

Volkan H. Ozguz, Aliso Viejo, CA (US);

Andrew Nelson Camien, Costa Mesa, CA (US);

Assignee:

Irvine Sensors Corporation, Costa Mesa, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/36 (2006.01); B29C 65/00 (2006.01); H01L 21/82 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method is disclosed for providing electrical connections to electronic elements within a multilayer module. The method includes providing first and second active layers having first and second edges, respectively. Each active layer includes a flexible, polymer substrate and at least one electronic element formed within the substrate. Electrically-conductive traces provide electrical connections from the first and second edges to the electronic elements. An adhesive is applied to at least one of a top surface of the first active layer and a bottom surface of the second active layer and the top surface of the first active layer is adhered to the bottom surface of the second active layer. The first edge and the second edge are aligned with each other thereby forming a side of the multilayer module. Electrically-conductive lines are applied along the side of the multilayer module to provide electrical connections to the traces.


Find Patent Forward Citations

Loading…