Company Filing History:

9 out of 92

Irvine Sensors Corporation

Rockwell International Corporation

patents

4. 2 out of 832,718

Other

patents

Years Active: 1992-2017

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14 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 9741680 - Wire bond through-via structure and method (2017-08-22),

2. 9431275 - Wire bond through-via structure and method (2016-08-30),

3. 7786562 - Stackable semiconductor chip layer comprising prefabricated trench interconnect vias (2010-08-31),

4. 7239012 - Three-dimensional module comprised of layers containing IC chips with overlying interconnect layers (2007-07-03),

5. 7127807 - Process of manufacturing multilayer modules (2006-10-31),

6. 6797537 - Method of making stackable layers containing encapsulated integrated circuit chips with one or more overlaying interconnect layers (2004-09-28),

7. 6784547 - Stackable layers containing encapsulated integrated circuit chips with one or more overlying interconnect layers (2004-08-31),

8. 6734370 - Multilayer modules with flexible substrates (2004-05-11),

9. 6717061 - Stacking of multilayer modules (2004-04-06),

10. 6560109 - Stack of multilayer modules with heat-focusing metal layer (2003-05-06),

11. 5635010 - Dry adhesive joining of layers of electronic devices (1997-06-03),

12. 5406701 - Fabrication of dense parallel solder bump connections (1995-04-18),

13. 5279991 - Method for fabricating stacks of IC chips by segmenting a larger stack (1994-01-18),

14. 5091288 - Method of forming detector array contact bumps for improved lift off of (1992-02-25),

Title: The Innovative Contributions of Angel Antonio Pepe

Introduction

Angel Antonio Pepe is a notable inventor based in Irvine, California, recognized for his significant contributions to the field of integrated circuit technology. With a total of 14 patents to his name, he has made remarkable advancements that have influenced the industry.

Latest Patents

Among his latest patents is the "Wire bond through-via structure and method." This invention describes a stackable integrated circuit chip layer and module device that eliminates the need for electrically conductive elements on the external surfaces of a layer containing an integrated circuit die. By utilizing conventional wire bonding equipment, this method provides an electrically conductive path defined by a wire bond segment encapsulated in potting material. This innovative approach allows for an electrically conductive wire bond 'through-via' that is accessible from at least the lower or second surface of the layer.

Career Highlights

Throughout his career, Angel Antonio Pepe has worked with various companies, including Irvine Sensors Corporation. His work has consistently focused on enhancing the functionality and efficiency of integrated circuits, showcasing his expertise and dedication to innovation.

Collaborations

Angel has collaborated with several professionals in the field, including James S. Yamaguchi and Volkan H. Ozguz. These collaborations have further enriched his work and contributed to the development of groundbreaking technologies.

Conclusion

Angel Antonio Pepe's innovative patents and career achievements highlight his significant role in advancing integrated circuit technology. His contributions continue to impact the industry positively, showcasing the importance of innovation in technology.

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2 patents pending (EPO):

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