Enter assignee name

% Expired Patents = 100.0

Forward Citations = 26

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11 inventors (with patents filed for the assignee):

W Eric Boyd (4 out of 20 patents)

James W Justice (3 out of 11 patents)

John F Leon (3 out of 12 patents)

4. Randy Bindrup (2 out of 4 patents)

5. Angel Antonio Pepe (2 out of 14 patents)

6. James S Yamaguchi (2 out of 18 patents)

7. David E Ludwig (2 out of 12 patents)

8. Medhat Azzazy (1 out of 9 patents)

9. Sambo He (1 out of 2 patents)

10. Christian Krutzik (1 out of 6 patents)

11. Medhet Azzazy (1 out of 1 patent)

7 patents: Sort by Forward Citations

1. 9741680 - Wire bond through-via structure and method (2017-08-22),

2. 9728507 - Cap chip and reroute layer for stacked microelectronic module (2017-08-08),

3. 9431275 - Wire bond through-via structure and method (2016-08-30),

4. 9142380 - Sensor system comprising stacked micro-channel plate detector (2015-09-22),

5. 9129780 - Stacked micro-channel plate assembly comprising a micro-lens (2015-09-08),

6. 9111621 - Solid state drive memory device comprising secure erase function (2015-08-18),

7. 9046322 - Self-calibrating targeting sight (2015-06-02),

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Profile summary based on public USPTO records.