San Clemente, CA, United States of America

W Eric Boyd

USPTO Granted Patents = 20 

Average Co-Inventor Count = 2.8

ph-index = 5

Forward Citations = 222(Granted Patents)


Location History:

  • San Clemete, CA (US) (2011)
  • Irvine, CA (US) (2012 - 2013)
  • San Clemente, CA (US) (2007 - 2014)
  • La Mesa, CA (US) (2013 - 2016)
  • Long Beach, CA (US) (2014 - 2017)
  • Costa Mesa, CA (US) (2017)

Company Filing History:


Years Active: 2007-2017

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20 patents (USPTO):Explore Patents

Title: Innovations of W Eric Boyd: Pioneering Microelectronics in San Clemente, CA

Introduction: W Eric Boyd stands out as an inventor based in San Clemente, California, holding an impressive portfolio of 20 patents. His contributions to the field of microelectronics demonstrate a profound understanding of integrated circuit technologies and innovative approaches to design and functionality.

Latest Patents: Among his latest advancements are the "Wire bond through-via structure and method" and the "Cap chip and reroute layer for stacked microelectronic module." The former patent introduces a stackable integrated circuit chip layer and module device, cleverly avoiding the use of electrically conductive elements on the external surfaces of a chip layer. Instead, it leverages conventional wire bonding equipment to create an encapsulated electrically conductive path. The latter patent presents a high-density reroute layer that facilitates the use of active or passive electronic elements, enhancing the design and efficiency of stacked microelectronic modules.

Career Highlights: Throughout his career, W Eric Boyd has showcased his inventive prowess while working at prominent companies such as Isc8 Inc. and PFG IP LLC. His journey through these organizations highlights his ability to blend theoretical knowledge with practical applications, leading to significant advancements in microelectronic technologies.

Collaborations: Boyd has collaborated with notable colleagues, including James S. Yamaguchi and Keith D. Gann. These relationships have enabled him to refine his ideas and push the boundaries of innovation in the tech industry, making substantial impacts through shared knowledge and expertise.

Conclusion: W Eric Boyd's contributions to microelectronics through his patents not only reflect his inventiveness but also his commitment to advancing technology. With a strong foundation in integrated circuit design and a collaborative spirit, he continues to pave the way for future innovations in the field.

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