The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 17, 2013
Filed:
Oct. 12, 2011
Peter Lieu, Irvine, CA (US);
James Yamaguchi, Laguna Niguel, CA (US);
Randy Bindrup, Trabucco Canyon, CA (US);
W. Eric Boyd, La Mesa, CA (US);
Peter Lieu, Irvine, CA (US);
James Yamaguchi, Laguna Niguel, CA (US);
Randy Bindrup, Trabucco Canyon, CA (US);
W. Eric Boyd, La Mesa, CA (US);
ISC8 Inc., Costa Mesa, CA (US);
Abstract
A method for fabricating a stackable integrated circuit layer and a device made from the method are disclosed. A stud bump is defined on the contact pad of an integrated circuit die and the stud-bumped die encapsulated in a potting material to define a potted assembly. A predetermined portion of the potting material is removed whereby a portion of the stud bump is exposed. One or more electrically conductive traces are defined on the layer surface and in electrical connection with the stud bump to reroute the integrated circuit contacts to predetermined locations on the layer to provide a stackable neolayer.