Peter Lieu

Title: **Innovative Contributions of Inventor Peter Lieu**

Introduction

Peter Lieu, based in Irvine, California, is a notable inventor with two patents to his name. His work primarily focuses on advancements in integrated circuit technology, showcasing his commitment to innovation in this critical field.

Latest Patents

Peter Lieu's latest patents include a groundbreaking method for fabricating a neo-layer and a method for depackaging prepackaged integrated circuit dies. The first patent elaborates on a method for creating a stackable integrated circuit layer using stud bumped bare dies. This involves defining a stud bump on the contact pad of an integrated circuit die, encapsulating it, and then rerouting the electrical connections to create a stackable neo-layer. The second patent addresses enhancing planarity in integrated circuit dies that exhibit surface warpage, such as those in ball grid array packages. It involves partially depackaging the integrated circuit while ensuring the active surface achieves improved uniformity.

Career Highlights

Peter works at ISC8 Inc., a company renowned for its innovations in integrated circuit design and packaging. His contributions significantly enhance the performance and reliability of electronic devices, positioning him as a key player in the field.

Collaborations

Throughout his career, Peter has collaborated with talented coworkers, including W. Eric Boyd and James S. Yamaguchi. Their combined expertise fosters an environment of creativity and innovation, as they work to address complex challenges in integrated circuit technology.

Conclusion

Peter Lieu is an influential inventor whose patents contribute substantially to the advancement of integrated circuit technology. His innovative methods demonstrate his dedication to pushing the boundaries of engineering, ensuring that future electronic devices operate with greater efficiency and reliability.