Costa Mesa, CA, United States of America

Andrew N Camien

USPTO Granted Patents = 8 

Average Co-Inventor Count = 3.2

ph-index = 7

Forward Citations = 336(Granted Patents)


Company Filing History:


Years Active: 1999-2010

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8 patents (USPTO):Explore Patents

Title: The Innovative Contributions of Andrew N Camien

Introduction

Andrew N Camien is a notable inventor based in Costa Mesa, California. He has made significant contributions to the field of semiconductor technology, holding a total of eight patents. His work focuses on enhancing the efficiency and functionality of electronic modules through innovative designs and manufacturing processes.

Latest Patents

One of Camien's latest patents is titled "Stackable semiconductor chip layer comprising prefabricated trench interconnect vias." This invention discloses a stackable layer and stacked multilayer module that allows individual integrated circuit die to be tested and processed at the wafer level. The design creates vertical area interconnect vias for routing electrical signals from the active surface of the die to the inactive surface. The vias are formed at predefined locations on each die using a series of semiconductor processing steps. The wafer is passivated, and the vias are filled with a conductive material. The bond pads on the die are exposed, and a metallization reroute from the user-selected bond pads and vias is applied. The wafer is then segmented to form thin, stackable layers that can be vertically interconnected, resulting in high-density electronic modules that can be further stacked to create more complex systems.

Another significant patent is the "Process of manufacturing multilayer modules." This method provides electrical connections to electronic elements within a multilayer module. It involves providing first and second active layers with flexible, polymer substrates and at least one electronic element formed within each substrate. Electrically-conductive traces connect the edges of the active layers to the electronic elements. An adhesive is applied to adhere the layers together, aligning their edges to form a side of the multilayer module. Electrically-conductive lines are then applied to provide connections to the traces.

Career Highlights

Throughout his career, Andrew N Camien has worked with various companies, including Irvine Sensors Corporation. His innovative work has significantly impacted the semiconductor industry, leading to advancements in electronic module design and manufacturing.

Collaborations

Camien has collaborated with notable professionals in the field, including James S Yamaguchi and Volkan H Ozguz. These collaborations have contributed to the development of cutting-edge technologies in semiconductor applications.

Conclusion

Andrew N Camien's contributions to semiconductor technology through his patents and collaborations highlight his role as an influential inventor. His innovative designs and methods continue to shape the future of electronic modules and

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