James Hermanowski

Title: James Hermanowski: Innovator in Semiconductor Wafer Technology

Introduction

James Hermanowski is an accomplished inventor based in Waterbury, Vermont, USA, with a notable portfolio that includes six patents to his name. His innovative work primarily focuses on advanced methodologies for semiconductor wafer processing, which is a crucial area in electronics and technology.

Latest Patents

Among his latest contributions to the industry are two significant patents concerning the thermal-slide debonding of temporarily bonded semiconductor wafers. The first patent presents a comprehensive method for debonding two temporary wafers that involves a detailed apparatus configuration. This includes a top chuck assembly, a bottom chuck assembly, and a static gantry, facilitating the movement and thermal processing of wafer pairs. The procedure optimizes the alignment and handling of these wafers, ultimately enabling efficient separation while applying necessary heat to the carrier wafer.

The second patent details the apparatus utilized for the same debonding process. It describes the structural components, such as a heater and wafer holder within the top chuck assembly, working in conjunction with the bottom chuck assembly controlled by an X-axis drive. This setup allows for precise control and separation of the wafers, highlighting Hermanowski's ability to blend mechanical design and innovative thermal processing techniques.

Career Highlights

James has had a distinguished career with experience at reputable companies in the semiconductor industry. He has worked at Suss Microtec Lithography GmbH, where he enhanced his expertise in lithography processes, and also at Nathaniel Group, Inc., where he contributed to high-level technological advancements. His professional journey reflects his commitment to innovation within the field of semiconductor technology.

Collaborations

Throughout his career, James has collaborated with talented colleagues such as Hale Johnson and Patrick Gorun. These partnerships have contributed to the successful development and implementation of his patented technologies, showcasing the importance of teamwork in achieving significant advancements in innovation.

Conclusion

James Hermanowski stands out as a key inventor in the semiconductor industry, with his contributions paving the way for improved methodologies in wafer processing. His six patents underscore his dedication to innovation and excellence in this technical field. As technology continues to evolve, innovators like Hermanowski will undoubtedly play an essential role in shaping its future.