The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 18, 2012
Filed:
Apr. 15, 2010
Gregory George, Colchester, VT (US);
Hale Johnson, Jericho, VT (US);
Patrick Gorun, Burlington, VT (US);
James Hermanowski, Waterbury, VT (US);
Matthew Stiles, Montpelier, VT (US);
Gregory George, Colchester, VT (US);
Hale Johnson, Jericho, VT (US);
Patrick Gorun, Burlington, VT (US);
James Hermanowski, Waterbury, VT (US);
Matthew Stiles, Montpelier, VT (US);
Suss Microtec Lithography, GmbH, Garching, DE;
Abstract
An apparatus for debonding two temporary bonded wafers includes a chuck assembly, a flex plate assembly and a contact roller. The chuck assembly includes a chuck and a first wafer holder to hold wafers in contact with the top surface of the chuck. The flex plate assembly includes a flex plate and a second wafer holder configured to hold wafers in contact with a first surface of the flex plate. The flex plate comprises a first edge arranged adjacent to a first edge of the chuck and connected to a hinge. The flex plate is configured to swing around the hinge and to be placed above the top surface of the chuck. The contact roller is arranged adjacent to a second edge of the chuck, which is diametrically opposite to its first edge. A debond drive motor moves the contact roller vertical to the plane of the chuck top surface.