Burlington, VT, United States of America

Patrick Gorun



Average Co-Inventor Count = 4.8

ph-index = 3

Forward Citations = 43(Granted Patents)


Company Filing History:


Years Active: 2010-2016

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5 patents (USPTO):

Title: **Innovator Patrick Gorun: Pioneering Advances in Semiconductor Debonding**

Introduction

Patrick Gorun, an accomplished inventor based in Burlington, Vermont, has made significant strides in the field of semiconductor technology. With a total of five patents to his name, Gorun's innovations focus on the methods and apparatuses that enhance the efficiency of semiconductor wafer processing.

Latest Patents

Among his most recent contributions is the patent for a "Method for Thermal-Slide Debonding of Temporary Bonded Semiconductor Wafers." This method describes a systematic approach to debonding two temporarily bonded wafers. It involves utilizing a debonder equipped with a top chuck assembly, a bottom chuck assembly, and a static gantry, optimized to transport the wafers from a loading zone to a processing zone.

Another notable patent is the "Apparatus for Thermal-Slide Debonding of Temporary Bonded Semiconductor Wafers." This patent outlines a sophisticated debonder apparatus designed for the same process, consisting of critical components such as a heater and a wafer holder, which facilitate the efficient and precise separation of the wafers when subjected to heat.

Career Highlights

Throughout his career, Patrick Gorun has worked with leading technology firms, including SUSS Microtec Lithography GmbH and SUSS Microtec AG. His involvement with these companies has undoubtedly allowed him to harness and refine his skills in semiconductor technologies, culminating in his groundbreaking patents.

Collaborations

Gorun's journey has also been marked by fruitful collaborations with skilled professionals in the industry. Notably, he has worked alongside Hale Johnson and James Hermanowski, sharing insights and expertise that have contributed to advancing semiconductor processing technologies.

Conclusion

In conclusion, Patrick Gorun stands out as a dedicated inventor whose innovations in semiconductor wafer debonding are paving the way for enhanced efficiencies in the field. With his five patents and collaborative efforts within the industry, Gorun continues to influence the landscape of semiconductor technology in meaningful ways.

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