The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 22, 2012
Filed:
Apr. 15, 2010
Hale Johnson, Jericho, VT (US);
Patrick Gorun, Burlington, VT (US);
Emmett Hughlett, Waterbury, VT (US);
James Hermanowski, Waterbury, VT (US);
Matthew Stiles, Montpelier, VT (US);
Michael Kuhnle, Hyde Park, VT (US);
Hale Johnson, Jericho, VT (US);
Patrick Gorun, Burlington, VT (US);
Emmett Hughlett, Waterbury, VT (US);
James Hermanowski, Waterbury, VT (US);
Matthew Stiles, Montpelier, VT (US);
Michael Kuhnle, Hyde Park, VT (US);
Suss Microtec Lithography, GmbH, Garching, DE;
Abstract
An improved apparatus for temporary wafer bonding includes a temporary bonder cluster and a debonder cluster. The temporary bonder cluster includes temporary bonder modules that perform electronic wafer bonding processes including adhesive layer bonding, combination of an adhesive layer with a release layer bonding and a combination of a UV-light curable adhesive layer with a laser absorbing release layer bonding. The debonder cluster includes a thermal slide debonder, a mechanical debonder and a radiation debonder.