Hyde Park, VT, United States of America

Michael Kuhnle


Average Co-Inventor Count = 6.0

ph-index = 1

Forward Citations = 19(Granted Patents)


Company Filing History:


Years Active: 2012

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1 patent (USPTO):Explore Patents

Title: Discovering the Innovations of Michael Kuhnle

Introduction

Michael Kuhnle, an inventive mind based in Hyde Park, Vermont, has contributed significantly to the field of microelectronics with his innovative approach to wafer bonding and debonding. As part of his work at Suss Microtec Lithography GmbH, he has a patented invention that showcases his skill and dedication to advancing technology.

Latest Patents

Kuhnle holds a patent for an "Apparatus for temporary wafer bonding and debonding." This invention is an improved apparatus that incorporates a temporary bonder cluster and a debonder cluster. The temporary bonder cluster consists of modules designed to perform various electronic wafer bonding processes, including adhesive layer bonding, the combination of an adhesive layer with a release layer bonding, and a combination of UV-light curable adhesive layers with laser absorbing release layers. The debonder cluster is equipped with a thermal slide debonder, a mechanical debonder, and a radiation debonder, which enhance the efficiency and effectiveness of the bonding and debonding processes.

Career Highlights

Michael Kuhnle’s career is marked by his pivotal role at Suss Microtec Lithography GmbH, where he has honed his expertise in microfabrication technologies. His innovative patent reflects his deep understanding of the complexities involved in wafer bonding processes and sets a benchmark for future advancements in the field.

Collaborations

Throughout his career, Kuhnle has worked alongside esteemed professionals like Hale Johnson and Patrick Gorun. Collaborating with such talented colleagues has undoubtedly enriched his work experience and contributed to his innovative thinking.

Conclusion

Michael Kuhnle stands out as a key inventor in the realm of microelectronics. His patented apparatus for wafer bonding and debonding represents a significant advancement in technology. With a passion for innovation and collaboration, Kuhnle continues to make impactful contributions that pave the way for future developments in his field.

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