This inventor holds 4 USPTO granted patents and 1 published patent application. Top assignees: Suss Microtec Lithography Gmbh, Suss Microtec Ag. Active years: 2010-2016.
Company Filing History:
Years Active: 2010-2016
Title: Emmett Hughlett: Innovator in Semiconductor Technology
Introduction
Emmett Hughlett is a notable inventor based in Waterbury, Vermont, recognized for his contributions to semiconductor technology. With a total of 4 patents to his name, Hughlett has made significant advancements in the field of thermal-slide debonding of semiconductor wafers.
Latest Patents
Hughlett's latest patents include a method and apparatus for thermal-slide debonding of temporary bonded semiconductor wafers. The method involves a debonder that comprises a top chuck assembly, a bottom chuck assembly, and a static gantry. This innovative approach allows for the efficient debonding of two temporary bonded wafers by applying heat while controlling the horizontal motion of the wafer assemblies. The apparatus features a heater and a wafer holder, which work together to facilitate the separation of the device wafer from the carrier wafer.
Career Highlights
Throughout his career, Emmett Hughlett has worked with prominent companies in the semiconductor industry, including SUSS Microtec Lithography GmbH and SUSS Microtec AG. His experience in these organizations has contributed to his expertise in developing advanced technologies for wafer processing.
Collaborations
Hughlett has collaborated with notable colleagues such as Hale Johnson and Patrick Gorun, further enhancing his work in the semiconductor field.
Conclusion
Emmett Hughlett's innovative work in semiconductor technology, particularly in thermal-slide debonding, showcases his significant contributions to the industry. His patents reflect a commitment to advancing semiconductor processing techniques, making him a key figure in this field.