The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 08, 2010
Filed:
Feb. 04, 2008
Hale Johnson, Jericho, VT (US);
G. Gerard Gormley, Worcester, VT (US);
Emmett Hughlett, Waterbury, VT (US);
Hale Johnson, Jericho, VT (US);
G. Gerard Gormley, Worcester, VT (US);
Emmett Hughlett, Waterbury, VT (US);
Suss Microtec AG, Garching, Munich, DE;
Abstract
An improved apparatus for semiconductor wafer bumping utilizes the injection molded solder process and is designed for high volume manufacturing. The apparatus includes equipment for filling patterned mold cavities on a mold structure with solder, equipment for positioning and aligning a patterned surface of a semiconductor structure directly opposite to the solder filled patterned mold cavities of the mold structure, a fixture tool for holding and transferring the aligned mold and semiconductor structures together, and equipment for receiving the fixture tool and transferring the solder from the aligned patterned mold cavities to the aligned patterned semiconductor first surface. The solder transfer equipment include a wafer heater stack configured to heat the semiconductor structure and a mold heater stack configured to heat the mold structure to a process temperature slightly above the solder's melting point. The fixture tool with the aligned mold and semiconductor structures is inserted between the wafer heater stack and the mold heater stack. A deposition chamber is formed between the wafer heater stack and the mold heater stack by sealing the wafer heater stack and the mold heater stack against the frame.