% Expired Patents = 100.0

EPO Patents = 1

Trademarks = 4

Forward Citations = 7

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6 inventors (with patents filed for the assignee):

Hale Johnson (3 out of 18 patents)

G Gerard Gormley (3 out of 6 patents)

Patrick Gorun (1 out of 5 patents)

4. Emmett Hughlett (1 out of 4 patents)

5. Wilhelm Lapointe (1 out of 1 patent)

6. Michael Davidson (1 out of 1 patent)

7. Gerard Gormley (0 patent)

4 patents: Sort by Forward Citations

1. 8088684 - Apparatus and method for semiconductor wafer bumping via injection molded solder (2012-01-03),

2. 7790596 - Apparatus and method for semiconductor wafer bumping via injection molded solder (2010-09-07),

3. 7732320 - Apparatus and method for semiconductor wafer bumping via injection molded solder (2010-06-08),

4. 7703658 - Apparatus and method for semiconductor wafer bumping via injection molded solder (2010-04-27),

Suss Microtec AG is a leading supplier of equipment and process solutions for the semiconductor industry. The company offers a comprehensive range of products including photomasks, wafer and bond aligners, and lithography systems. With over 60 years of experience in the industry, Suss Microtec AG is recognized for its innovative technologies and high-quality solutions for advanced semiconductor manufacturing.

Profile summary based on public USPTO records.

Company Badge

USPTO Data Jan 1 1976 - Oct 6 2026

4 Patents

#344 in Munich

#7,032 in Germany

Munich, Germany

Suss Microtec Ag