logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9281229 B1

PDFFull Text
Date of Patent:
Mar. 08, 2016

Filed:

Dec. 01, 2014

Method for thermal-slide debonding of temporary bonded semiconductor wafers

Applicant:

Suss Microtec Lithography Gmbh, Garching, DE;

Inventors:

Gregory George, Colchester, VT (US);

Hale Johnson, Jericho, VT (US);

Patrick Gorun, Burlington, VT (US);

Emmett Hughlett, Waterbury, VT (US);

James Hermanowski, Waterbury, VT (US);

Matthew Stiles, Montpelier, VT (US);

Assignee:

SUSS MicroTec Lithography GmbH, Garching, DE;

Attorney:

Fenwick & West LLP

Primary Examiner:

Mark A Osele

Assistant Examiner:

Nickolas Harm

Int. Cl.
CPC ...
B32B 38/10 (2006.01); H01L 21/683 (2006.01); B32B 43/00 (2006.01); H01L 21/67 (2006.01); H01L 21/673 (2006.01); B32B 38/18 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6835 (2013.01); B32B 43/006 (2013.01); H01L 21/673 (2013.01); H01L 21/67092 (2013.01); H01L 21/67132 (2013.01); B32B 38/1858 (2013.01); B32B 2309/105 (2013.01); B32B 2457/14 (2013.01); H01L 2221/68318 (2013.01); H01L 2221/68327 (2013.01); Y10S 156/93 (2013.01); Y10S 156/932 (2013.01); Y10S 156/941 (2013.01); Y10S 156/942 (2013.01); Y10S 156/943 (2013.01); Y10T 29/49817 (2015.01); Y10T 29/53274 (2015.01); Y10T 156/1132 (2015.01); Y10T 156/1153 (2015.01); Y10T 156/1158 (2015.01); Y10T 156/1168 (2015.01); Y10T 156/1189 (2015.01); Y10T 156/1911 (2015.01); Y10T 156/1917 (2015.01); Y10T 156/1944 (2015.01); Y10T 156/1972 (2015.01); Y10T 156/1978 (2015.01); Y10T 279/18 (2015.01); Y10T 279/21 (2015.01); Y10T 279/26 (2015.01); Y10T 279/29 (2015.01);
Abstract

A method for debonding two temporary bonded wafers, includes providing a debonder comprising a top chuck assembly, a bottom chuck assembly, a static gantry supporting the top chuck assembly, an X-axis carriage drive supporting the bottom chuck assembly and an X-axis drive control configured to drive horizontally the X-axis carriage drive and the bottom chuck assembly from a loading zone to a process zone under the top chuck assembly and from the process zone back to the loading zone. Next, loading a wafer pair comprising a carrier wafer bonded to a device wafer via an adhesive layer upon the bottom chuck assembly at the loading zone oriented so that the unbonded surface of the device wafer is in contact with the bottom assembly. Next, driving the X-axis carriage drive and the bottom chuck assembly to the process zone under the top chuck assembly. Next, placing the unbonded surface of the carrier wafer in contact with the top chuck assembly and holding the carrier wafer by the top chuck assembly. Next, initiating horizontal motion of the X-axis carriage drive while heat is applied to the carrier wafer and while the carrier wafer is held by the top chuck assembly.

Find Patent Forward Citations

Loading…