Tempe, AZ, United States of America

James F Vanell

This inventor holds 17 USPTO granted patents, primarily in Chemical Mechanical Planarization. Top assignees: Motorola Corporation, Freescale Semiconductor,inc.. Active years: 1998-2004.

IDiyas Innovation Intelligence. (2026). Inventor Profile: James F Vanell. Retrieved from https://idiyas.com/inventor/james-f-vanell

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 94.1

Average Co-Inventor Count = 1.3

ph-index = 8

Forward Citations = 220(Granted Patents)


Company Filing History:


Years Active: 1998-2004

Loading Chart...
Areas of Expertise:
Chemical Mechanical Planarization
Wafer Carrier
Material Removal
Filter Apparatus
Pad Conditioner
End Effector
Translation Mechanism
Dynamically Mixing Slurry
Platen Coating
Polishing System
Point Of Use Dilution Tool
Semiconductor Component
17 patents (USPTO):Explore Patents

Title: **James F Vanell: Innovator in Chemical Mechanical Planarization**

Introduction

James F Vanell, an accomplished inventor based in Tempe, AZ, has made significant contributions to the field of chemical mechanical planarization (CMP). With a remarkable portfolio of 17 patents, his work has advanced the technology used in semiconductor manufacturing and polishing processes.

Latest Patents

Among his latest innovations, Vanell has developed the "Pad Conditioner Coupling and End Effector for a Chemical Mechanical Planarization System and Method Therefor." This patent outlines a pad conditioner coupling that securely holds an end effector for abrading a polishing media surface, essential for the planarization of the polishing media, removal of particulates, and enhancement of polishing slurry transportation. The design incorporates various components, such as shoulder screws, polymer bearings, a static plate, a wave spring, and a floating plate, enabling effective and precise operation.

Another significant patent is the "Wafer Carrier and Method of Material Removal from a Semiconductor Wafer." This invention features a wafer carrier adjustable to facilitate varying material removal rates from a semiconductor wafer without vacuum assistance. It comprises an elastically flexed wafer support structure that conforms to the semiconductor wafer, improving wafer planarity during the polishing process.

Career Highlights

James F Vanell has had a commendable career with notable companies including Motorola Corporation and Freescale Semiconductor, Inc. His extensive experience in semiconductor technologies has positioned him as a leading figure in the field of inventions related to CMP systems.

Collaborations

Throughout his career, Vanell has collaborated with several talented colleagues, including James A Grootegoed and Todd W Buley. Their partnerships have fostered innovative ideas and advancements in semiconductor processing technologies.

Conclusion

With his impressive array of patents and a strong professional background, James F Vanell continues to influence the semiconductor industry. His innovative spirit and dedication to improving CMP processes make him a noteworthy inventor in the field.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…