Motorola Corporation

Freescale Semiconductor,inc.

James F Vanell

James A Grootegoed

Todd W Buley

James M Mullins

Laura John

Steven D Ward

Chad B Bray

A pad conditioner coupling ( ) holds an end effector ( ) for abrading a polishing media surface. Pad conditioning planarizes the polishing media surface, removes particulates, and roughens the polishing media surface to promote the transport of polishing slurry. Pad conditioner coupling ( ) comprises shoulder screws ( ), polymer bearings ( ), a static plate ( ), a wave spring ( ), and a floating plate ( ). Wave spring ( ) is placed between static plate ( ) and floating plate ( ). The shoulder screws ( ) connect through the static plate ( ) and fasten to the floating plate ( ) to hold the wave spring ( ) in a preloaded condition. The polymer bearings ( ) prevent the shoulder screws ( ) from contacting the static plate ( ). Wave spring ( ) allows the floating plate ( ) to move in a non-parallel position to the static plate ( ) for angular compensation in the pad conditioning process.

Pad conditioner coupling and end effector for a chemical mechanical planarization system and method therfor

An ultrasonic driver ( ) is used to vibrate a filter disk ( ) at ultrasonic frequencies. Vibrations are used to break up agglomerates into smaller pieces that pass through filter disk ( ). The energy is controlled to minimize the translational energy given to the particles as they are broken up to prevent reagglomeration. The frequency and amplitude of the vibration is controlled to operate out of or in low energy cavitation.

Filter apparatus and method therefor

A wafer carrier ( ) for a CMP tool is adjustable to provide center fast to edge fast material removal from a semiconductor wafer. The wafer carrier ( ) holds the semiconductor wafer without vacuum. The semiconductor wafer is held by a carrier ring ( ). An elastically flexed wafer support structure ( ) is a support surface for the semiconductor wafer. Elastically flexed wafer support structure ( ) can be bowed outward or bowed inward in an infinite number of different contours. The semiconductor wafer conforms to the contour of the elastically flexed wafer support structure ( ) when a down force is applied to the wafer carrier ( ) during a polishing process. Changing the contour is used to produce different material removal rates across the radius of the semiconductor wafer to increase wafer planarity in a polishing process.

Wafer carrier and method of material removal from a semiconductor wafer

A wafer carrier assembly ( ) places a semiconductor wafer in angular compliance with a polishing media. The wafer carrier assembly ( ) includes a first assembly and a second assembly. The second assembly inclines freely in any direction for providing angular compliance.

Carrier assembly for chemical mechanical planarization systems and method

Pad conditioner coupling and end effector for a chemical mechanical planarization system and method therefor

Chemical mechanical planarization (CMP) of semiconductor wafers presents a harsh abrasive and chemical environment for equipment used in a polishing process. Prior art translation mechanisms are prone to failure due to corrosion and require maintenance that exposes the polishing process to contamination from lubricants. A translation mechanism ( ) requiring no lubrication is designed to have maintenance at intervals greater than a CMP tool. The translation mechanism ( ) includes a housing ( ) and a moveable mount ( ). The housing ( ) and the moveable mount ( ) are made of hardened stainless steel which is impervious to the CMP environment. Bearing shafts ( ) buffer a threaded shaft ( ) from side loading on the moveable mount ( ). Polymer bearings ( ) connected to moveable mount ( ) provide a low friction contact surface to bearing shafts ( ). A polymer translation nut ( ) connects to the moveable mount ( ) and is threaded onto the threaded shaft ( ).

Translation mechanism for a chemical mechanical planarization system and method therefor

A dilution tool ( ) and a method to prepare a solution by mixing of two fluids in a filter ( ) to form a desired solution. Sealless pumps ( ) are driven by a common motor ( ) to pump the fluids at a constant ratio of their respective flow rates while the flow rate of the solution varies. The conductivity or resistivity of the solution is measured with a measurement device ( ) to determine the concentration.

Point of use dilution tool and method

A method of manufacturing a semiconductor component includes forming a first layer over a semiconductor substrate, providing a mixture comprised of a first component and a second component, optically detecting a concentration of the first component in the mixture, and applying the mixture to the first layer. A chemical-mechanical polishing (CMP) system (,) for use in the method includes a vessel (,) having a first input port (,), a CMP slurry output port (,), and a CMP slurry sensing port (,). The CMP system also includes a refractometer (,) adjacent to the CMP slurry sensing port.

Method of manufacturing a semiconductor component and chemical-mechanical polishing system therefor

A pad conditioner coupling (,) holds an end effector (,) for abrading a polishing media surface. Pad conditioning planarizes the polishing media surface, removes particulates, and roughens the polishing media surface to promote the transport of polishing slurry. Pad conditioner coupling (,) comprises shoulder screws (,), polymer bearings (,), a static plate (,), a wave spring (,), and a floating plate (,). Wave spring (,) is placed between static plate (,) and floating plate (,). The shoulder screws (,) connect through the static plate (,) and fasten to the floating plate (,) to hold the wave spring (,) in a preloaded condition. The polymer bearings (,) prevent the shoulder screws (,) from contacting the static plate (,). Wave spring (,) allows the floating plate (,) to move in a non-parallel position to the static plate (,) for angular compensation in the pad conditioning process.

A chemical mechanical planarization tool that reduces a volume of polishing chemistry used in a wafer polishing process includes a rinse bar (87) for removing polishing chemistry and particulates from a polishing media and a slurry measurement system (84) for regulating a pump (83) of a slurry delivery system. A volume of the slurry delivery system is reduced to less than 100 milliliters. Approximately a minimum volume of polishing chemistry for polishing a single wafer is dispensed during each wafer polishing process of a wafer lot. During each wafer polishing process the slurry delivery system is purged to prevent settling, agglomeration, and hardening of the polishing chemistry. The rinse bar (87) sprays a surface of the polishing media to remove spent polishing chemistry and particulates prior to polishing another semiconductor wafer.

Chemical mechanical planarization system

Chemical mechanical planarization (CMP) of semiconductor wafers presents a harsh abrasive and chemical environment for equipment used in a polishing process. Prior art translation mechanisms are prone to failure due to corrosion and require maintenance that exposes the polishing process to contamination from lubricants. A translation mechanism (31) requiring no lubrication is designed to have maintenance at intervals greater than a CMP tool. The translation mechanism (31) includes a housing (32) and a moveable mount (33). The housing (32) and the moveable mount (33) are made of hardened stainless steel which is impervious to the CMP environment. Bearing shafts (39) buffer a threaded shaft (36) from side loading on the moveable mount (33). Polymer bearings (51) connected to moveable mount (33) provide a low friction contact surface to bearing shafts (39). A polymer translation nut (41) connects to the moveable mount (33) and is threaded onto the threaded shaft (36).

Translation mechanism for a chemical mechanical planarization system and

A chemical mechanical planarization tool (21) comprises a platen (22), a wafer carrier arm (31), a carrier assembly (37), a conditioning arm (28), and an end effector (33). A slurry delivery system (51) reduces waste by providing polishing chemistry at a minimum required delivery rate that ensures consistent wafer planarization. The slurry deliver system comprises a check valve (52), a diaphragm pump (53), a check valve (54), a back pressure valve (55), and a dispense bar (58). The diaphragm pump (53) provides a precise volume of polishing chemistry with each pump cycle, independent of input pressure. The check valves (52,54) prevent reverse flow of the polishing chemistry through the diaphragm pump (53). Back pressure valve (55) creates a pressure differential across the check valve (54) to prevent the flow of polishing chemistry during a downstroke of the diaphragm pump (53). The polishing chemistry is dispensed onto a polishing media from dispense bar (58).

Chemical mechanical polishing system and method therefor

A dilution tool (100) and a method prepare a solution of two fluids for removing residue from a semiconductor wafer. The fluids are combined in a filter (130) to form the desired solution. Sealless pumps (141, 142) are driven by a common motor (143) to pump the fluids at a constant ratio of their respective flow rates while the flow rate of the solution varies. The conductivity of the solution is measured with a conductivity meter (166) to determine the concentration.

Growing community of inventors

Tempe, AZ, United States of America

James F Vanell