The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 19, 2002
Filed:
Oct. 20, 2000
James F. Vanell, Tempe, AZ (US);
Motorola, Inc., Schaumburg, IL (US);
Abstract
Chemical mechanical planarization (CMP) of semiconductor wafers presents a harsh abrasive and chemical environment for equipment used in a polishing process. Prior art translation mechanisms are prone to failure due to corrosion and require maintenance that exposes the polishing process to contamination from lubricants. A translation mechanism ( ) requiring no lubrication is designed to have maintenance at intervals greater than a CMP tool. The translation mechanism ( ) includes a housing ( ) and a moveable mount ( ). The housing ( ) and the moveable mount ( ) are made of hardened stainless steel which is impervious to the CMP environment. Bearing shafts ( ) buffer a threaded shaft ( ) from side loading on the moveable mount ( ). Polymer bearings ( ) connected to moveable mount ( ) provide a low friction contact surface to bearing shafts ( ). A polymer translation nut ( ) connects to the moveable mount ( ) and is threaded onto the threaded shaft ( ).