The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 31, 2001
Filed:
May. 19, 2000
Applicant:
Inventors:
James F. Vanell, Tempe, AZ (US);
Chad B. Bray, Chandler, AZ (US);
Assignee:
Motorola, Inc., Schaumburg, IL (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 4/900 ; B24B 5/100 ;
U.S. Cl.
CPC ...
B24B 4/900 ; B24B 5/100 ;
Abstract
A method of manufacturing a semiconductor component includes forming a first layer over a semiconductor substrate, providing a mixture comprised of a first component and a second component, optically detecting a concentration of the first component in the mixture, and applying the mixture to the first layer. A chemical-mechanical polishing (CMP) system (,) for use in the method includes a vessel (,) having a first input port (,), a CMP slurry output port (,), and a CMP slurry sensing port (,). The CMP system also includes a refractometer (,) adjacent to the CMP slurry sensing port.