IDiyas

For the Inventor, By the Inventor

Albuquerque, NM, United States of America

James D Wesselkamper

USPTO Granted Patents = 17 

Average Co-Inventor Count = 3.0

ph-index = 7

Forward Citations = 153(Granted Patents)


Company Filing History:

goldMedal16 out of 5,002 
 
Xilinx, Inc.
 patents
silverMedal1 out of 7 
 
Xlnx, Inc.
 patents

Years Active: 2013-2025

Loading Chart...
17 patents (USPTO):
1. 12361808 - Tamper sensor for 3-dimensional die stack (2025-07-15),
2. 12093394 - System and method for secure deconstruction sensor in a heterogeneous integration circuitry (2024-09-17),
3. 12081238 - Registration of a PUF signature and regeneration using a trellis decoder (2024-09-03),
4. 11582021 - Protection against differential power analysis attacks involving initialization vectors (2023-02-14),
5. 11379580 - Mixed storage of data fields (2022-07-05),
6. 11280829 - System-on-chip having secure debug mode (2022-03-22),
7. 11216591 - Incremental authentication for memory constrained systems (2022-01-04),
8. 10978167 - Efuse bank and associated anchor bits (2021-04-13),
9. 10466275 - Glitch detector and test glitch generator (2019-11-05),
10. 10288496 - Ring oscillator for temperature or voltage sensing (2019-05-14),
11. 10044514 - Secure external key storage for programmable ICS (2018-08-07),
12. 10027492 - Method of and circuit for generating a physically unclonable function (2018-07-17),
13. 9530022 - Protection of designs for electronic systems (2016-12-27),
14. 9230112 - Secured booting of a field programmable system-on-chip including authentication of a first stage boot loader to mitigate against differential power analysis (2016-01-05),
15. 9218505 - Programmable integrated circuit with DPA-resistant decryption (2015-12-22),

Title: Innovations of James D Wesselkamper

Introduction

James D Wesselkamper is a notable inventor based in Albuquerque, NM (US), recognized for his contributions to the field of integrated circuit technology. With a total of 17 patents to his name, he has made significant advancements in the area of secure circuitry and tamper detection.

Latest Patents

Among his latest patents is the "Tamper sensor for 3-dimensional die stack." This invention describes an integrated circuit die stack capable of detecting physical tampering events. The design includes a first integrated circuit die with a sensor network that extends across its entire top surface, and a second die stacked below it, which receives sensing signals through a network of through-silicon vias. Another notable patent is the "System and method for secure deconstruction sensor in a heterogeneous integration circuitry." This invention outlines a method for securely booting heterogeneous integration circuitry, incorporating entropy sources and a key generation circuit to enhance security during the booting process.

Career Highlights

James has worked with prominent companies such as Xilinx, Inc. and Xlnx, Inc., where he has contributed to various innovative projects. His experience in these organizations has allowed him to refine his skills and develop groundbreaking technologies.

Collaborations

James has collaborated with talented individuals in the field, including Jason J Moore and Edward S Peterson. These partnerships have fostered a creative environment that has led to the development of advanced technologies.

Conclusion

James D Wesselkamper's work in integrated circuit technology showcases his innovative spirit and dedication to enhancing security in electronic systems. His patents reflect a commitment to addressing modern challenges in technology.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…