The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 24, 2026

Filed:

Jun. 08, 2023
Applicant:

Xilinx, Inc., San Jose, CA (US);

Inventors:

James David Wesselkamper, Albuquerque, NM (US);

Thomas Leboeuf, Sandia Park, NM (US);

James Bertil Anderson, Madison, AL (US);

Jason Moore, Albuquerque, NM (US);

Assignee:

XILINX, INC., San Jose, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/532 (2006.01); H01L 25/065 (2023.01);
U.S. Cl.
CPC ...
H01L 23/576 (2013.01); H01L 23/573 (2013.01); H01L 25/0657 (2013.01); H01L 23/53209 (2013.01); H01L 2225/06527 (2013.01);
Abstract

Disclosed circuit arrangements include a physically unclonable function (PUF) entropy source having passive circuit elements and active circuit elements. A first die has one or more metal layers and an active layer, and the passive circuit elements are disposed in the one or more metal layers. A second die has one or more metal layers and an active layer. The active circuit elements are coupled to the passive circuit elements and are disposed in the active layer of the second die, and the first die and the second die are in a stacked structure. The stacked structure has the one or more metal layers of the first die disposed between the active layer of the first die and the active layer of the second die.


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