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For the Inventor, By the Inventor

Icheon, South Korea

Jaepil Kim

This inventor holds 3 USPTO granted patents. Top assignee: Stats Chippac Pte. Ltd.. Active years: 2011-2015.

USPTO Granted Patents = 3

% Patents Active = 100.0

Average Co-Inventor Count = 5.7

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:

goldMedal3 out of 1,842 
 
Stats Chippac Pte. Ltd.
 patents

Years Active: 2011-2015

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3 patents (USPTO):Explore Patents
1. 9129978 - Integrated circuit packaging system with void prevention mechanism and method of manufacture thereof (2015-09-08),
2. 8227903 - Integrated circuit packaging system with encapsulant containment and method of manufacture thereof (2012-07-24),
3. 7863761 - Integrated circuit package system with molding vents (2011-01-04),
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