The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 08, 2015
Filed:
Jun. 24, 2014
Integrated circuit packaging system with void prevention mechanism and method of manufacture thereof
Jaepil Kim, Icheon-si, KR;
Seokhyun Kim, Gyeongju-si, KR;
Daeup Bae, Seoul, KR;
Jaewon Kim, Seoul, KR;
Jaekang Yoo, Icheon-si, KR;
Sungpil Hur, Icheon-si, KR;
Jaepil Kim, Icheon-si, KR;
Seokhyun Kim, Gyeongju-si, KR;
Daeup Bae, Seoul, KR;
Jaewon Kim, Seoul, KR;
Jaekang Yoo, Icheon-si, KR;
Sungpil Hur, Icheon-si, KR;
STATS ChipPAC Ltd., Singapore, SG;
Abstract
An integrated circuit packaging system, and a method of manufacture of an integrated circuit packaging system thereof, includes: a singulation substrate having an air vent portion having longitudinal grooves in the air vent portion, the longitudinal grooves all parallel to each other; an integrated circuit die attached to the singulation substrate; and a molding compound on the singulation substrate, on the air vent portion, in a portion of the longitudinal grooves, and on the integrated circuit die.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile