Location History:
- Yeouju-kun, KR (2011)
- Icheon-si, KR (2015)
Company Filing History:
Years Active: 2011-2015
Title: The Innovative Contributions of Sungpil Hur
Introduction
Sungpil Hur is a notable inventor based in Icheon-si, South Korea. He has made significant contributions to the field of integrated circuit packaging, holding a total of 2 patents. His work focuses on enhancing the efficiency and reliability of integrated circuit systems.
Latest Patents
Sungpil Hur's latest patents include an integrated circuit packaging system with a void prevention mechanism and a method of manufacture thereof. This innovative system features a singulation substrate with an air vent portion that has longitudinal grooves, all parallel to each other. An integrated circuit die is attached to the singulation substrate, and a molding compound is applied to various parts of the substrate and the die.
Another significant patent is the integrated circuit package system with molding vents. This system involves providing a substrate, attaching an integrated circuit die over it, and connecting a connector to both the die and the substrate. An encapsulant is then formed over these components, minimizing ambient gas deformation to prevent the connector from touching another connector.
Career Highlights
Sungpil Hur is currently employed at Stats Chippac Pte. Ltd., where he continues to innovate in the field of integrated circuit packaging. His work has been instrumental in advancing the technology used in electronic devices.
Collaborations
Throughout his career, Sungpil has collaborated with talented individuals such as Jaepil Kim and Seokhyun Kim. These collaborations have contributed to the development of cutting-edge technologies in the industry.
Conclusion
Sungpil Hur's contributions to integrated circuit packaging demonstrate his commitment to innovation and excellence. His patents reflect a deep understanding of the complexities involved in electronic systems, making him a valuable asset in the field.