The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 04, 2011
Filed:
Aug. 03, 2007
Dal Jae Lee, Yeoju-gun, KR;
Nam Ju Cho, Uiwang-si, KR;
Soo-san Park, Seoul, KR;
Jaepil Kim, Icheon-si, KR;
Sungpil Hur, Yeouju-kun, KR;
Hyeong Kug Jin, Seoul, KR;
Jongmin Han, Seoul, KR;
Sungjae Lim, Yongin-si, KR;
Hyoungchul Kwon, Seoul, KR;
Dal Jae Lee, Yeoju-gun, KR;
Nam Ju Cho, Uiwang-si, KR;
Soo-San Park, Seoul, KR;
Jaepil Kim, Icheon-si, KR;
Sungpil Hur, Yeouju-kun, KR;
Hyeong Kug Jin, Seoul, KR;
JongMin Han, Seoul, KR;
SungJae Lim, Yongin-si, KR;
HyoungChul Kwon, Seoul, KR;
Stats Chippac Ltd., Singapore, SG;
Abstract
An integrated circuit package system comprising: providing a substrate; attaching an integrated circuit die over the substrate; attaching a connector to the integrated circuit die and the substrate; and forming an encapsulant over the substrate, the integrated circuit die, and the connector and minimizing ambient gas deformation of the substrate to keep the connector from touching another connector.