This inventor holds 1 USPTO granted patent. Top assignee: Stats Chippac Pte. Ltd.. Active years: 2011.
Company Filing History:
Years Active: 2011
Title: JongMin Han: Innovator in Integrated Circuit Packaging
Introduction
JongMin Han is a prominent inventor based in Seoul, South Korea. He has made significant contributions to the field of integrated circuit packaging. His innovative approach has led to the development of a unique patent that addresses critical challenges in the industry.
Latest Patents
JongMin Han holds a patent for an "Integrated circuit package system with molding vents." This invention involves a comprehensive system that includes providing a substrate, attaching an integrated circuit die over the substrate, and connecting a connector to both the integrated circuit die and the substrate. The encapsulant is formed over these components while minimizing ambient gas deformation of the substrate to prevent the connector from touching another connector. This patent showcases his expertise in enhancing the reliability and efficiency of integrated circuit packages. He has 1 patent to his name.
Career Highlights
JongMin Han is currently employed at Stats Chippac Pte. Ltd., a company known for its advanced packaging solutions in the semiconductor industry. His work at Stats Chippac has allowed him to collaborate with leading experts and contribute to groundbreaking technologies in integrated circuits.
Collaborations
Throughout his career, JongMin has worked alongside talented colleagues, including Dal Jae Lee and SungJae Lim. Their collaborative efforts have fostered an environment of innovation and creativity, leading to advancements in integrated circuit packaging.
Conclusion
JongMin Han is a notable inventor whose work in integrated circuit packaging has made a significant impact on the industry. His patent reflects his commitment to innovation and excellence in technology.