The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 24, 2012
Filed:
Sep. 15, 2010
Hye Ran Lee, Ichon-si, KR;
Tae Keun Lee, Ichon-si, KR;
Jaepil Kim, Icheon-si, KR;
Jungho Seo, Icheon-si, KR;
Hye Ran Lee, Ichon-si, KR;
Tae Keun Lee, Ichon-si, KR;
Jaepil Kim, Icheon-si, KR;
JungHo Seo, Icheon-si, KR;
Stats Chippac Ltd, Singapore, SG;
Abstract
A method of manufacture of an integrated circuit packaging system includes: providing a substrate; forming layers having non-horizontal strip patterns and non-vertical strip patterns over the substrate; mounting an integrated circuit device on the substrate adjacent the non-horizontal strip patterns and the non-vertical strip patterns; and applying an encapsulation over the integrated circuit device, the encapsulation restricted by the layers to prevent the encapsulation from reaching an edge of the substrate.