Tae Keun Lee

Title: The Innovative Contributions of Tae Keun Lee

Introduction

Tae Keun Lee is a prominent inventor based in Ichon-si, South Korea. He has made significant contributions to the field of integrated circuit packaging, holding a total of 18 patents. His work has advanced the technology used in electronic devices, making them more efficient and compact.

Latest Patents

Among his latest patents is the "Integrated Circuit Package System with Mold Gate." This innovative system includes providing a substrate, forming a conductive layer over the substrate, and creating a mold gate layer with an organic material without polymerization over the conductive layer. Additionally, it involves attaching an integrated circuit over the substrate adjacent to the mold gate layer. Another notable patent is the "Stackable Integrated Circuit Package System." This system features a stacked integrated circuit package-in-package design, which includes forming a first external interconnect, mounting a first integrated circuit die below it, and stacking a second integrated circuit die in an offset configuration. This design allows for efficient encapsulation while keeping the first integrated circuit die partially exposed.

Career Highlights

Tae Keun Lee works at Stats Chippac Pte. Ltd., a company known for its expertise in semiconductor packaging solutions. His role at the company has allowed him to collaborate on various innovative projects that push the boundaries of integrated circuit technology.

Collaborations

Some of his notable coworkers include Hun Teak Lee and Soo Jung Park. Their collaborative efforts have contributed to the successful development of advanced packaging systems in the semiconductor industry.

Conclusion

Tae Keun Lee's contributions to integrated circuit packaging have made a significant impact on the electronics industry. His innovative patents and collaborative work continue to shape the future of technology.