The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 20, 2010
Filed:
Dec. 07, 2006
Applicants:
Hun Teak Lee, Ichon, KR;
Tae Keun Lee, Ichon-si, KR;
Soo Jung Park, Yongin-si, KR;
Inventors:
Assignee:
Stats Chippac Ltd., Singapore, SG;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/538 (2006.01); H01L 23/02 (2006.01); H01L 23/495 (2006.01); H01L 23/522 (2006.01); H01L 23/52 (2006.01); H01L 25/065 (2006.01); H01L 23/28 (2006.01); H01L 23/31 (2006.01); H05K 7/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
An integrated circuit package system that includes: providing an electrical interconnect system including a first lead-finger system and a second lead-finger system; stacking a second device over a first device between the first lead-finger system and the second lead-finger system; connecting the second device to the second lead-finger system with a bump bond; stacking a dummy device over the second device; and connecting the first device to the first lead-finger system with a wire bond.