Stats Chippac Pte. Ltd.

Jaepil Kim

Sungpil Hur

Jaewon Kim

Soo-San Park

Tae Keun Lee

Hye Ran Lee

Nam Ju Cho

Jaekang Yoo

JungHo Seo

Seokhyun Kim

Dal Jae Lee

JongMin Han

SungJae Lim

Daeup Bae

HyoungChul Kwon

Hyeong Kug Jin

An integrated circuit packaging system, and a method of manufacture of an integrated circuit packaging system thereof, includes: a singulation substrate having an air vent portion having longitudinal grooves in the air vent portion, the longitudinal grooves all parallel to each other; an integrated circuit die attached to the singulation substrate; and a molding compound on the singulation substrate, on the air vent portion, in a portion of the longitudinal grooves, and on the integrated circuit die.

Integrated circuit packaging system with void prevention mechanism and method of manufacture thereof

A method of manufacture of an integrated circuit packaging system includes: providing a substrate; forming layers having non-horizontal strip patterns and non-vertical strip patterns over the substrate; mounting an integrated circuit device on the substrate adjacent the non-horizontal strip patterns and the non-vertical strip patterns; and applying an encapsulation over the integrated circuit device, the encapsulation restricted by the layers to prevent the encapsulation from reaching an edge of the substrate.

Integrated circuit packaging system with encapsulant containment and method of manufacture thereof

An integrated circuit package system comprising: providing a substrate; attaching an integrated circuit die over the substrate; attaching a connector to the integrated circuit die and the substrate; and forming an encapsulant over the substrate, the integrated circuit die, and the connector and minimizing ambient gas deformation of the substrate to keep the connector from touching another connector.

Integrated circuit package system with molding vents

Growing community of inventors

Icheon-si, South Korea

Jaepil Kim