Beaverton, OR, United States of America

Jaejin Lee

This inventor holds 30 USPTO granted patents and 5 published patent applications and 6 EPO patents, primarily in Electromagnetic Shielding. Top assignees: Intel Corporation, Microsoft Technology Licensing, LLC, Apple Inc.. Active years: 2018-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Jaejin Lee. Retrieved from https://idiyas.com/inventor/jaejin-lee-uc1atvm8

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 30 

% Patents Active = 100.0

 

Average Co-Inventor Count = 3.4

ph-index = 2

Forward Citations = 11(Granted Patents)


Location History:

  • Hillsboro, OR (US) (2019 - 2020)
  • Beaverton, OR (US) (2018 - 2024)
  • Redmond, WA (US) (2024)

Company Filing History:


Years Active: 2018-2026

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Areas of Expertise:
Electromagnetic Interference
Noise Reduction
Thermal Management
Radio Frequency
Integrated Circuit
Wireless Power
Shielding Techniques
Flexible Circuit
Electronic Devices
Connector Design
Heat Spreader
Crosstalk Mitigation
30 patents (USPTO):Explore Patents

Title: Jaejin Lee: Innovator in Electromagnetic Interference Shielding

Introduction

Jaejin Lee, based in Beaverton, Oregon, is a prolific inventor known for his impressive portfolio of 24 patents. His work primarily focuses on advanced technologies aimed at enhancing electronic device performance through innovative solutions for electromagnetic interference and thermal management.

Latest Patents

Among his latest innovations, Jaejin Lee has developed a patent for an electromagnetic interference (EMI) shielding enclosure with thermal conductivity. This invention relates to apparatuses and techniques for EMI shielding without occupying any surface area of a printed circuit board (PCB). The design features a planar top with walls extending down to the PCB's bottom surface, allowing the PCB itself to be sandwiched between the planar top and the bottom surface. A ground from the PCB electrically couples with these walls, which in turn connect with an EMI gasket applied to the bottom chassis, significantly enhancing the volume of EMI shielding.

Another notable patent focuses on a heat pipe designed to reduce radio frequency interference. This invention describes an electronic device that includes a substrate and a heat source, with a heat pipe featuring a series of bumps extending toward the substrate but remaining uncontacted. These bumps provide a resonant frequency within a specific radio frequency band, effectively acting as a filter to mitigate interference in electronic devices.

Career Highlights

Jaejin Lee's career is marked by significant stints at major technology firms, including Intel Corporation and Microsoft Technology Licensing, LLC. His experiences at these companies have provided a robust foundation for his patent development, allowing him to refine his innovative ideas in high-stakes environments.

Collaborations

Throughout his career, Jaejin has worked alongside talented individuals such as Hao-Han Hsu and Dong-Ho Han. These collaborations have likely contributed to his success in developing advanced technological solutions and enhancing the overall quality of his inventions.

Conclusion

Jaejin Lee's contributions to the field of electromagnetic interference shielding and thermal management exemplify his commitment to innovation. With a portfolio of 24 patents and a strong career spanning influential tech companies, he continues to be a key player in the advancement of electronic technologies.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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