The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 17, 2026

Filed:

Nov. 03, 2020
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Jayprakash Thakur, Bangalore, IN;

Ofir Degani, Haifa, IL;

Ronen Kronfeld, Shoham, IL;

Ehud Reshef, Qiryat Tivon, IL;

Seong-Youp J. Suh, Portland, OR (US);

Tal Shoshana, Ein Ayala, IL;

Eytan Mann, Modiin, IL;

Maruti Tamrakar, Durg, IN;

Ashoke Ravi, Portland, OR (US);

Jose Rodrigo Camacho Perez, Guadalajara, MX;

Timo Sakari Huusari, Hillsboro, OR (US);

Eli Borokhovich, Modiin-Maccabim-Reut, IL;

Amir Rubin, Kiryat Ono, IL;

Ofer Benjamin, Petach-Tikva, IL;

Tae Young Yang, Portland, OR (US);

Harry Skinner, Beaverton, OR (US);

Kwan Ho Lee, San Jose, CA (US);

Jaejin Lee, Beaverton, OR (US);

Dong-Ho Han, Beaverton, OR (US);

Shahar Gross, Nes Ziona, IL;

Eran Segev, Tel Aviv, IL;

Telesphor Kamgaing, Chandler, AZ (US);

Assignee:

INTEL CORPORATION, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04B 1/40 (2015.01);
U.S. Cl.
CPC ...
H04B 1/40 (2013.01);
Abstract

In various aspects, a radio frequency circuit is provided. The radio frequency circuit may include a substrate that may include a radio frequency front-end to antenna (RF FE-to-Ant) connector. The RF FE-to-Ant connector may include a conductor track structure and a substrate connection structure coupled to the conductor track structure. The substrate may include radio frequency front-end circuitry monolithically integrated in the substrate. The substrate connection structure may include at least one of a solderable structure, a weldable structure, or an adherable structure. The substrate connection structure may be configured to form at least one radio frequency signal interface with an antenna circuit connection structure of a substrate-external antenna circuit. The substrate may include an edge region. The substrate connection structure may be disposed in the edge region.


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