The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 10, 2024

Filed:

Dec. 18, 2020
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Jaejin Lee, Hillsboro, OR (US);

James Panakkal, KA, IN;

Min Suet Lim, Penang, MY;

Aiswarya M. Pious, Karnataka, IN;

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 9/00 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0224 (2013.01); H05K 1/0236 (2013.01); H05K 9/0024 (2013.01); H05K 2201/10371 (2013.01);
Abstract

Embodiments described herein may be related to apparatuses, processes, and techniques related to EMI shielding and thermal conduction without using any surface area of a PCB. Embodiments of the EMI shield may include a planar top, with one or more walls extending from the planar top to a bottom surface of the PCB, the PCB having a top surface disposed between the bottom surface of the PCB and the planar top. A ground of the PCB may electrically couple with the one or more walls. The bottom of the walls may couple with an EMI gasket applied to a bottom chassis to increase the volume of EMI shielding. Other embodiments may be described and/or claimed.


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