The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 20, 2024
Filed:
Apr. 26, 2022
Applicant:
Microsoft Technology Licensing, Llc, Redmond, WA (US);
Inventors:
Assignee:
Microsoft Technology Licensing, LLC, Redmond, WA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 9/00 (2006.01); H05K 1/02 (2006.01); H05K 3/28 (2006.01);
U.S. Cl.
CPC ...
H05K 9/0088 (2013.01); H05K 1/0216 (2013.01); H05K 3/284 (2013.01); H05K 2203/1322 (2013.01);
Abstract
Provided is a conformal electromagnetic interference (EMI) shielding film including a thermal-forming film layer and an electrically conductive film layer. The thermal-forming film layer is configured to conformally coat over one or more electronic components mounted on a substrate with application of heat. The electrically conductive film layer is formed on an opposite side of the thermal-forming film layer from the substrate and has a plurality of voids that are configured to deform during the application of heat and allow the electrically conductive film layer to conform together with the thermal-forming film layer.