The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 03, 2024

Filed:

Dec. 15, 2020
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Kae-An Liu, Taipei, TW;

Jaejin Lee, Beaverton, OR (US);

David W. Browning, Portland, OR (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03H 7/01 (2006.01); H01P 1/20 (2006.01); H01Q 1/02 (2006.01); H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
H03H 7/0115 (2013.01); H01P 1/2005 (2013.01); H01Q 1/02 (2013.01); H05K 7/20336 (2013.01);
Abstract

Particular embodiments described herein provide for an electronic device that can be configured to include a substrate, a heat source on the substrate, and a heat pipe. The heat pipe includes a plurality of bumps that extend from the heat pipe towards the substrate but do not come into contact with the substrate. The bumps are configured to help mitigate radio frequency interference in the electronic device. More specifically, the bumps can be configured to provide a resonant frequency in a specific radio frequency band and act as a radio frequency filter.


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