Cheonan, South Korea

Jae-Hoon Choi

This inventor holds 26 USPTO granted patents and 1 published patent application and 3 EPO patents, primarily in Semiconductor Packaging. Top assignees: Samsung Electronics Co., Ltd., Samsung Sdi Co., Inc., Samsung Electro-Mechanics Co., Ltd.. Active years: 2011-2020.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Jae-Hoon Choi. Retrieved from https://idiyas.com/inventor/jae-hoon-choi-nf17zvsx

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 26 

% Patents Active = 65.4


Average Co-Inventor Count = 3.7

ph-index = 3

Forward Citations = 42(Granted Patents)


Location History:

  • Seoul, KR (2011 - 2017)
  • Hwaseong-si, KR (2016 - 2017)
  • Cheonan-si, KR (2011 - 2018)
  • Gyeongsangbuk-do, KR (2017 - 2018)
  • Yongin-si, KR (2013 - 2020)

Company Filing History:


Years Active: 2011-2020

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Areas of Expertise:
Printed Circuit Board
Semiconductor Package
Wearable Antenna
Electromagnetic Shielding
Battery Pack
Data Storage Device
Protective Circuit Module
Ultra-Wideband Antenna
Light Emitting Device
Substrate Drying
Conductive Member
Benzophenone Derivatives
26 patents (USPTO):Explore Patents

Title: Innovator Spotlight: Jae-Hoon Choi

Introduction

Jae-Hoon Choi is a prominent inventor based in Cheonan-si, South Korea, with an impressive portfolio of 26 patents. His contributions to the field of electronics, particularly in printed circuit board technology, have positioned him as a key figure in the industry.

Latest Patents

Among Jae-Hoon Choi's latest patents are two groundbreaking inventions. The first is an "Electronic Component Embedded Printed Circuit Board and Method of Manufacturing the Same," which integrates an electronic component into an insulation layer, featuring a connection terminal that is exposed on the surface. This innovation also introduces a bump on the connection terminal, enhancing functionality and reliability.

The second patent, titled "Embedded Board and Method of Manufacturing the Same," encompasses an embedded board that consists of an insulating layer, a first circuit layer embedded within, and a second circuit layer located above it. This design allows for the arrangement of electronic elements inside the insulating layer, with additional features like a metal pillar and vias that facilitate effective electrical connections.

Career Highlights

Jae-Hoon Choi has made significant strides while working with prominent companies such as Samsung Electronics Co., Ltd. and Samsung SDI Co., Inc. His roles in these organizations have empowered him to explore and develop advanced technologies that have a substantial impact on the electronics market.

Collaborations

Throughout his career, Jae-Hoon has collaborated with fellow innovators including Chang-Yong Park and Ki-Woong Kim. These partnerships have fostered a creative environment that has led to the development of several key patents, highlighting the importance of teamwork in the field of innovation.

Conclusion

Jae-Hoon Choi's commitment to advancing technology in printed circuit board design is evident through his numerous patents and collaborative efforts. As he continues to innovate, his work will undoubtedly influence the future of electronic components and their integration into various applications.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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