The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 13, 2018
Filed:
Apr. 12, 2016
Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;
Sung-Uk Lee, Suwon-si, KR;
Il-Jong Seo, Cheongju-si, KR;
Jae-Hoon Choi, Yongin-si, KR;
Yong-Ho Baek, Seoul, KR;
Samsung Electro-Mechanics Co., Ltd., Suwon-si, KR;
Abstract
A printed circuit board and a method of manufacturing a printed circuit board are provided. The printed circuit board includes an insulating layer, a circuit layer embedded in the insulating layer, a solder resist layer disposed on one surface of the insulating layer, the solder resist layer having a cavity of a through-hole shape to expose a part of the circuit layer from the insulating layer, and a metal post embedded in the solder resist layer and exposed to outside via an opening of the solder resist layer, and the metal post includes a first post metal layer, a post barrier layer, and a second post metal layer disposed in that order.