Samsung Electronics Co., Ltd.

Samsung Sdi Co., Inc.

Samsung Electro-mechanics Co., Ltd.

Hyundai Motor Company

Lg Innotek Co., Ltd.

Industry-university Cooperation Foundation Hanyang University

Chong Kun Dang Pharmaceutical Corporation

Pyeong Hwa Automotive Co., Ltd.

Emw Co., Ltd.

Jae-Hoon Choi

Chang-Yong Park

Ki-Woong Kim

Young-Hoon Kim

Jong-Chul Choi

Dong-Woo Shin

Chang-Ryong Heo

Seong-Chan Han

Yong-Ho Baek

Hyung-Bok Lee

Dong-Chun Lee

Joong-Hun Kim

Li-Yeon Kang

Min-Jong Lim

In-Won Hwang

Sang-Soo Lee

Jung-Hoon Kim

Sangsoo Lee

Jae-Young Kim

Sangkyu Lee

Jung-Hyun Cho

Jung-Hyun Park

Dong-Soo Kim

Ki Young Song

Woo-Young Choi

Jae-Phil Boo

Young-Gwan Ko

Hyo-Jae Bang

Dong-Sub Kim

Rak Jun Choi

Min-Woo Yoo

Kwang-Min Kil

Ho-Sik Park

Dongsub Kim

Dong-Keun Lee

Joon-Sung Lee

Yong-sok Yang

Byung-Hoon Ryou

Sang-Kyu Lee

Hyung-Mo Hwang

Seok-Hwan Ahn

Hun Taek Han

Won-Mo Sung

Seung-Kee Moon

Soon-Kil Ahn

Buem Yeon Lee

Nam-Yong Oh

Keon-Sik Seo

Hai-Young Lee

Jae-Seon Hwang

Jae-Uk Ryu

Sung-Sook Lee

Sung-Taek Lim

Jae-geun Ha

Yong-Sam Lee

Sun-Kyu Hwang

Sang-jae Lee

Nam-Song Choi

Kwangmin Gil

Jae-Kwang Lee

Ho-Jin Choi

Soo-Jin Kim

Gyu-Tae Park

Byeong-Hoon Han

Dal-Hyun Kim

Kyung-Joo Lee

Su-Yeal Bae

Jin-Keun Park

Yang-Woon Roh

Kyeol Kwon

Ji-hwan Lee

Soon-Yong Lee

Jinkeun Park

Jae-chan Lee

Kang-Min Paek

Yong-Ju Kim

Sung-Kyun Lim

Sung-Uk Lee

Hee-Ryong Kang

Il-Jong Seo

Hyuk-Bok Lee

A printed circuit board and method thereof include an electronic component embedded in an insulation layer and comprising a connection terminal exposed on a surface of the insulation layer. The printed circuit board and method thereof also include a bump formed on the connection terminal of the electronic component and exposed on the surface of the insulation layer.

Electronic component embedded printed circuit board and method of manufacturing the same

Disclosed is an embedded board and a method of manufacturing the same. The embedded board may include an insulating layer a first circuit layer formed inside the insulating layer a second circuit layer formed on an upper part of the first circuit layer, and the second circuit layer being disposed inside the insulating layer, a first electronic element arranged inside the insulating layer, the first electronic element being spaced apart from the second circuit layer, a metal pillar formed between the first circuit layer and the second circuit layer or the first electronic element, and a first via formed on the upper part of the second circuit layer inside the insulating layer.

Embedded board and method of manufacturing the same

A printed circuit board and a method of manufacturing a printed circuit board are provided. The printed circuit board includes an insulating layer, a circuit layer embedded in the insulating layer, a solder resist layer disposed on one surface of the insulating layer, the solder resist layer having a cavity of a through-hole shape to expose a part of the circuit layer from the insulating layer, and a metal post embedded in the solder resist layer and exposed to outside via an opening of the solder resist layer, and the metal post includes a first post metal layer, a post barrier layer, and a second post metal layer disposed in that order.

Printed circuit board and method of manufacturing the same

A semiconductor package includes a semiconductor chip mounted on a substrate. The semiconductor package further includes an electromagnetic wave shielding member. The electromagnetic wave shielding member includes an upper surface and a plurality of side surfaces. The electromagnetic wave shielding member surrounds an upper surface and side surfaces of the semiconductor chip. The semiconductor package further includes a hooking member formed from a deformation of a lower end of one of the side surfaces of the electromagnetic wave shielding member. The hooking member is interposed between the semiconductor chip and the substrate to fix the electromagnetic wave shielding member.

Semiconductor package and semiconductor device including an electromagnetic wave shielding member

An electronic device, a protection device, and a method for protecting the electronic device with the protection device is provided. The electronic device includes a sensor module configured to detect a motion state of the electronic device when a cover is connected to the electronic device, and a processor configured to control an actuator of the cover based on the detected motion state of the electronic device.

Electronic device, and device and method for protecting the electronic device

Disclosed is a human body wearable dual band antenna. The disclosed human body wearable antenna comprises: a substrate; a zeroth-order resonance antenna formed on the bottom of the substrate, for receiving a signal from a wireless device which is implanted in a human body; and a micro strip antenna formed on the top of the substrate, for transmitting the signal to a wireless device which is external to the human body. The dual band human body wearable antenna according to the present invention can relay communications between the wireless device which is implanted in the human body and the wireless device which is external to the human body.

Human body wearable antenna having dual bandwidth

An electronic device may include: at least one protective member disposed in at least one area of the electronic device; at least one sensor configured to detect the drop of the electronic device; a protective member driving module configured to activate the protective member to change the shape of the protective member according to whether the drop of the electronic device is detected; and at least one processor configured to receive a drop sensing signal detected by the sensor and to control the protective member driving module to change the shape of the protective member.

Electronic device including protective member

A semiconductor package includes a substrate having a groove in an upper surface. A semiconductor device is mounted on the substrate to cover one portion of the groove and leaving another portion exposed.

Semiconductor package

A package substrate includes: a body layer; and a pattern layer formed on a surface of the body layer. The pattern layer includes: a wire pattern; a solder pad connected to the wire pattern; and a through hole adjacent to a boundary between the wire pattern and the solder pad and vertically penetrating the pattern layer. A semiconductor package and an electronic device are disclosed.

Package substrate and semiconductor package including the same

An apparatus for drying a substrate may include a spin chuck, a drying chamber and a drying fluid line. The spin chuck may be configured to support the substrate. The spin chuck may rotate the substrate. The drying chamber may be configured to receive the spin chuck. The drying chamber may have an inlet, an outlet and a vortex exhaust. A drying fluid may be supplied through the inlet into the drying chamber. The drying fluid may be drained through the outlet. A vortex of the drying fluid may be drained through the vortex exhaust. The drying fluid line may be connected to the inlet.

Single type apparatus for drying a substrate and single type system for cleaning a substrate including the same

An element embedded printed circuit board includes: a substrate including an insulation layer, a first circuit layer formed on a first surface of the insulation layer, and a second circuit layer formed on a second surface of the insulation layer; and an element including an electrode part and embedded in the insulation layer, wherein the electrode part is in contact with the first circuit layer.

Element embedded printed circuit board and method of manufacturing the same

Disclosed is a light emitting device. The light emitting device includes a nano-structure, a first semiconductor layer on the nano-structure, an active layer on the first semiconductor layer, and a second conductive semiconductor layer on the active layer. The nano-structure includes a graphene layer disposed under the first semiconductor layer to make contact with the first semiconductor layer; and a plurality of nano-textures extending from a top surface of the graphene layer to the first semiconductor layer and contacted with the first semiconductor layer.

Light emitting device and light emitting device package having the same

A detent hood hinge which includes a hinge bracket fixed to a vehicle body, and a hinge arm rotatably coupled to the hinge bracket at a first end, a hood being coupled to a second end of the hinge arm may include a detent bracket coupled to the hinge arm and having a slide hole perforated on one side, a sleeve pin mounted so as to protrude from the slide hole at one end and coupled to the detent bracket so as to be slidable along the slide hole, a spring configured to be elastically deformed in accordance with sliding of the sleeve pin, and a lock stopper fixed to the hinge bracket and formed with a seating groove.

Detent hood hinge

A battery pack that has one or more batteries and a protection circuit module. The battery pack includes protection tab members that connect to the batteries and the tab members include a tab that has a coupling component that extends towards the batteries. The battery pack also includes a conductive member that connects the connection tab member to the protection circuit module. The battery pack also includes spacers that receive the connection tabs and that couple to the coupling component of the connection tabs and are interconnected to the conductive member and the spacers.

Battery pack including spacer receiving conductive member

A battery pack having at least two battery cells arranged parallel to each other, a protection circuit module adjacent to at least one of the battery cells, and a temperature measuring member attached to the protection circuit module and extending between, and in contact with, the two battery cells, the temperature measuring member measuring a temperature of one of the battery cells, the temperature measuring member being fixedly and removably attached to the at least one of the battery cells.

Battery pack

Growing community of inventors

Cheonan-si, South Korea

Jae-Hoon Choi